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NCSP 1616

Size : 1.6*1.6*0.9mm

 

Features:

• Package Miniaturization

• NCSP package technology

• High heat resistance EMC packaging

• Big welding plate design, Strengthen the weldability

• With silicone molding technology to reduce internal

   stress and improve reliability

  • Specification
  • Test report
  • Application Manual
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